# MAX3243 carrier — PROVISIONAL female CAD reference / VERIFY MALE Footprint: `Carrier:MAX3243_Reference_Provisional` in `Carrier.pretty/MAX3243_Reference_Provisional.kicad_mod`. Intended only for a <=100 × 100 mm, two-copper-layer carrier PCB draft. No schematic assignment or edits are made. This footprint does not establish whole-board fit, connector access, DRC compliance, or fabrication readiness. ## Evidence and scope The user reports that the male **6253** module has the same dimensions. This is not confirmation of its pad map. Geometry below is taken from published **female 5988** Eagle CAD, not verified male-specific CAD. Confirm the purchased module's identity, orientation, header numbering, outline and mounting geometry before release. Never infer header order from DE-9 gender or mating-face numbering. Source: [Adafruit PCB repository](https://github.com/adafruit/Adafruit-RS-232-Level-Shifter-Breakout-PCB), commit `63c6200bb3ef17d491089cfa6441b1810d79bb20`. Local original: `reference/Adafruit RS-232 Full Pinout Level-Shifter Breakout.brd`; SHA-256 `6a7b35ef909f5a2d243c326c34db3957aaa01275bf2aac8e0c749ff18162e870` was rechecked against the file. See `adafruit-research.md` for provenance and female/male distinctions. CAD-derived geometry adapted from the design by **Limor Fried/Ladyada for Adafruit Industries**, under **CC BY-SA 3.0 Unported**: https://creativecommons.org/licenses/by-sa/3.0/ . The CAD-derived footprint and these CAD-derived notes use that license. Preserve the full upstream notices in `reference/README.md` and `reference/license.txt` when redistributing this adaptation. Changes: coordinate transformation, carrier pad convention, NPTH carrier holes, and provisional annotations; no module circuitry or connector package copied. ## View, origin and exact nominal geometry Front/component top view, module facing up, DE-9 toward the top (**negative Y**). Origin is header JP2 pin 1, not a PCB corner. X increases rightward; Y downward. Transform Eagle board coordinates in mm with: `x = X - 1.905; y = 2.667 - Y`. - Pads 1…12: `(2.54 × (N - 1), 0)`, first-to-last span 27.94 mm. - Full bare-module outline is on `F.Fab`, **not carrier `Edge.Cuts`**. Bounds: X = -1.905…29.845, Y = -26.670…2.667 (31.750 × 29.337 mm). Top corners are square. Bottom corners retain the source 2.540 mm radius arcs. - Left arc: (-1.905, 0.127) to (0.635, 2.667), centre (0.635, 0.127). Right arc: (27.305, 2.667) to (29.845, 0.127), centre (27.305, 0.127). Midpoints use radius/sqrt(2), rounded to nine decimal places in the file; the arcs are not chamfers or a bounding-box approximation. - Two unnumbered **3.00 mm NPTH carrier holes**: (1.905, -8.763) and (26.035, -8.763), spacing 24.130 mm. These transfer module-hole centres and drill diameter only. The source module holes are actually plated, 3.60 mm copper / 3.00 mm drill, unconnected in the source signal map. Carrier NPTH deliberately does not copy that plating or assign electrical connections. No screw, washer, standoff or tool-access clearance is implied. ## Provisional carrier pads and female reference map Same convention documented in `footprint-notes.md` for the other carrier modules: **1.70 × 1.70 mm PTH pads / 1.00 mm drills**, rectangular pad 1, circular pads 2…12, `*.Cu` and `*.Mask`, unused copper layers retained. That convention derives from the installed KiCad `PinHeader_1x04_P2.54mm_Vertical`; it is not a selected header/socket qualification. The source module itself uses 1.9304 mm round pads. Confirm actual pins/sockets, finished-hole tolerances, annular rings and assembly height before fabrication. Square pad 1 is a carrier marker, not source evidence. | Pad | X (mm), Y=0 | Female label | Female CAD net | |---:|---:|---|---| | 1 | 0.00 | Vin | VCC | | 2 | 2.54 | GND | GND | | 3 | 5.08 | DCD | DCD | | 4 | 7.62 | RX | RXD | | 5 | 10.16 | TX | TXD | | 6 | 12.70 | DTR | DTR | | 7 | 15.24 | DSR | DSR | | 8 | 17.78 | RTS | RTS | | 9 | 20.32 | CTS | CTS | | 10 | 22.86 | RI | RI | | 11 | 25.40 | VLD | !INVALID | | 12 | 27.94 | OFF | !FORCEOFF | **This is the female reference map, NOT a confirmed male map.** Footprint pads have numbers only, no assigned nets. OFF is active low; VLD indicates valid input when high. This project's logic interface requires 3.3 V Vin. ## Intentionally omitted / release gates The footprint F.Fab outline still describes only the bare module PCB. Subsequent STEP B-rep measurements now establish nominal shell/flange/hex-post envelopes and registration; see `db9-mechanical-notes.md`. The user explicitly confirms identical male/female external dimensions. A1 board-local Dwgs.User projections show those nominal bounds, without changing this footprint's pads or deriving drills from the 3D model. Mating-plug/cable, case wall/cutout, assembly height and actual fit remain unqualified. No guessed complete courtyard or 3D mounting offset is added. There is **no fake courtyard**; courtyard checks cannot establish assembly fit. Short silkscreen labels identify PROVISIONAL / FEMALE CAD REF / VERIFY MALE. Before layout release: verify male pad map and orientation against the actual module or authoritative male CAD; perform a 1:1 fit check; select headers and mounting hardware; verify assembled and mating envelopes; then establish real clearances/courtyard and check the complete <=100 × 100 mm two-layer layout. ## Validation performed KiCad **10.0.6** `pcbnew.FootprintLoad` successfully loaded the footprint using system Python (`/usr/bin/python3 -B`) in a read-only inline check. Assertions passed for all 12 numbered pad positions against source JP2 package/element coordinates, female signal-contactref order, pad sizes/drills/shapes and copper/mask presence, no assigned header nets, both NPTH centres/sizes/drills, and all six transformed source outline segments including both 90-degree, 2.540 mm radius arcs and centres. Also checked absence of courtyard, Edge.Cuts, zones and 3D models. The first check assumed arc endpoint order was preserved; KiCad normalizes arc orientation. The corrected check matches endpoint pairs independent of order and verifies radius, angle and centre; it passed without changing geometry. The binding emitted the same three startup `PROPERTY_ENUM` assertions documented for other module validation; these did not prevent loading or successful checks. No hardware fit test, male electrical verification, board DRC or firmware build was performed. Existing `validate_footprints.py` was not changed and does not cover this new footprint. Only this notes file and the new footprint were written; schematic, project and lock files were left untouched.