Record Accepted PCB Placement And Fit

Align component groups, repair affected routing, and add preservation
audits.
Assign the confirmed U2 footprint and update pull-ups to 2 kΩ across
design files.
Document user acceptance, switch to an A3 worksheet, and refresh PCB
exports.

hardware/PCB/validation/pcb-validation-summary.json

@@ -39,31 +39,31 @@
       26.67
     ],
     "DS1": [
-      43,
+      43.97,
       36
     ],
     "R1": [
-      43,
-      34
+      42.16,
+      32.6685
     ],
     "R2": [
-      54,
-      34
+      53.16,
+      32.6685
     ],
     "R3": [
-      65,
-      34
+      64.16,
+      32.6685
     ],
     "SW1": [
-      43,
+      41.72,
       68
     ],
     "SW2": [
-      55,
+      53.72,
       68
     ],
     "SW3": [
-      67,
+      65.72,
       68
     ],
     "H1": [
@@ -95,8 +95,8 @@
     "hex_mouth_overhang": 2.87,
     "flange_front_inset": 1.93
   },
-  "tracks": 565,
-  "vias": 22,
+  "tracks": 938,
+  "vias": 41,
   "copper_layers": 2,
   "draft_thickness_mm": 1.6,
   "electrical_footprints": 9,
@@ -104,7 +104,7 @@
   "physical_DRC_violations": 0,
   "unconnected_items": 0,
   "schematic_pad_nets_match": true,
-  "known_parity_warning": "U2 reference footprint assigned on PCB only; schematic footprint intentionally blank; nominal male external metal dimensions user-confirmed",
+  "schematic_parity_violations": 0,
   "project_settings_sha256": "9ad5b992785ebfe01fa7ea4e1aa391a2c7d7f1f2c3b1c13136173c301ecb6516",
   "ignored_DRC_checks": [
     {
@@ -128,15 +128,19 @@
       "key": "footprint_type_mismatch"
     }
   ],
-  "not_validated": [
-    "male module pin map/header fit",
-    "ESP32 measured-planar 1:1 fit and complete assembly envelope/heights",
-    "header/socket fit",
-    "RF performance and antenna clearance",
-    "power/return-path integrity",
-    "USB power path",
-    "OLED pull-ups",
-    "fabrication process",
-    "hardware operation"
-  ]
+  "user_accepted": [
+    "module dimensions/visual fit and USB clearance",
+    "male pinout/header/footprint and pin-by-pin review",
+    "M3 carrier/module and M2 display hardware",
+    "RF keepout and power/ground routing"
+  ],
+  "not_independently_verified": [
+    "reported 10 mm assembled module elevation",
+    "regulator margin",
+    "USB backfeed safety",
+    "OLED onboard pull-up resistance/rail",
+    "manufacturer RF qualification",
+    "fabrication process/certification"
+  ],
+  "new_hardware_tests": false
 }