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Integrate DB9 mounting into enclosure lid

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Commander1024
2026-09-26 13:50:55 +02:00
parent f925293d3f
commit c5bf3e32f5
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docs/agent/current-state.md
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@@ -11,7 +11,9 @@ Working memory, not an implementation timeline. Source is authoritative; begin w
## Parametric enclosure — initial concept, physical validation pending
- `hardware/case/` corrected per user: 5 mm base insert bosses directly support carrier underside Z7.4/top Z9; two M3 RS-232 and four M2 OLED brass male/female bodies ABOVE carrier span 10 mm to module underside Z19. Studs cross actual 1.6 mm carrier holes into respective inserts; four separate carrier holes take direct M3 screws. ESP32 has no supplied mounting holes and remains header-supported. No under-carrier brass or printable spacers remain. Shell now **106 × 86.8 × 37.4 mm**, roof underside Z35 (10 mm lower); ports/display/DB9 panel/hangers/buttons follow the corrected datums. Red RF overlay/enclosure reserve restriction removed; physical antenna retained, no Wi-Fi guarantee and no PCB/schematic/copper/reserve/layout/export changes.
- Four default CGAL exports, native registration (including hole diameters/no ESP32 NPTH), evaluated stack/stud/nozzle-web fixtures, closed-edge mesh checks and two parameter CGAL smoke tests passed; both updated previews visually inspected. Not printed, assembled or physically tested. Actual underside solder/prong clearance within 5 mm, brass shoulder/insert lands, unknown stud lengths (4 mm reference gives 2.4 mm engagement), insert usable threads, header mating height, USB Z/plug envelopes, OLED height, switches and DB9 panel-jackscrew thread/removability/reach remain explicit gates. Panel cable-lock axes are 25 mm, module holes 24.13 mm; no M3 inference from STEP bores. See `hardware/case/README.md` and `checks.md` before printing.
- Superseding DB9 change: separate plate/export/mode and M3 insert hangers removed. Cover now has integral nominal 48 mm-wide × 2.4 mm-thick connector panel at Y−0.47…1.93, Z21.07…35, continuous roof connection and two nominal 6 mm forward ribs outside flange bounds, extended into the wall to close former 1 mm side slits. Bottom-open 18.078 mm shell slot and closed Ø3.6 post holes at real 25 mm spacing permit straight vertical lowering **after removing both screw posts and all cables**; front-wall recess also opens to seam. Panel clears PCB by 0.5 mm and anchors by 3.10 mm in Y. No horizontal-slide claim. Insert count now 10 M3 + 4 M2, all base. Added forward-only base closure Y−3.4…−0.5: shoulders Z20.82, 17.578038-wide tongue Z21.69762024, 0.25 mm seams, 0.6 below STEP shell, 0.5 forward of module PCB. PCB files untouched.
- Three default CGAL exports, native registration (including flange plane, hole diameters/no ESP32 NPTH), evaluated stack/connector/stud/web fixtures, edge-manifold meshes, three parameter CGAL smoke tests and continuous 60 mm vertical envelope sweeps passed; restored-post negative control detects blockage. Thicker-panel sweep caught and fixed residual inner-wall strip; default and raised/thicker variant now pass. Closure follow-up regenerated base/lid and all three previews (unchanged plungers revalidated); default plus two variant sweeps include per-step upstand/lid travel, base/lid seating and electronics insertion. Four parameter mesh tests pass; closure guards and STEP shell-minimum registration added. Three regenerated previews visually inspected, including bare-lid detail. This is selected-envelope CAD clearance, not complete hardware or strength qualification.
- DB9 hardware remains a gate: no inferred M3/4-40 thread; removability, stud length, engagement and cable reach unmeasured. Panel consumes 2.4 mm of stud reach; verified longer studs/extensions may be needed. Reseated 4.8 mm bodies move mouths to Y−5.27, **1.4 mm ahead of nose**: full mating may require compatible shorter-body hardware and must be physically verified. Nose remains 0.47 mm beyond outer wall / 3.4 mm beyond panel. Do not force an incompatible post/cable combination or claim stock threads sufficient. Actual underside solder/prong clearance within 5 mm, brass lands/studs/inserts, header height, USB/glass/buttons and load strength also remain gates. See `hardware/case/README.md` and `checks.md`; no print, physical assembly or hardware test performed.
## PCB accepted-fit labels and worksheet — complete